The Dimensity 1050 is Mediatek’s first mmWave 5G chipset. It will be possible to seamlessly convert between Sub-6GHz and mmWave standards with this technology. To now, TSMC has promised devices with the chip in Q3 of 2022, and the chip is constructed on a 6nm process.
Both the Filogic 880 and the Filogic 380 have Wi-Fi 7 and Bluetooth 5.3 integration from Taiwanese manufacturer Filogic.
Dual-core processors with 2.5 GHz clock speeds and 6-core processors with 2.0 GHz clock speeds power the Dimensity 1050’s octa-core CPU. Carrier aggregation is a major difference between mmWave and Sub-6.
Finally, Mediatek unveiled two new CPUs that would power the low- to mid-range smartphones of the future. It has a quicker connection than the Dimensity 930 and HDR10+ support for 120Hz monitors. The second is Helio G99, a 6nm version of the LTE-only Helio G96, rather than the 12nm Helio G96 that was released in 2012.